05 June 2024 – Vanguard International Semiconductor Corporation and NXP Semiconductors have entered into a joint venture to build and operate a new 300mm wafer fabrication facility in Singapore. The project represents a major milestone for both companies. Construction of the fab’s initial phase is scheduled to commence in the second half of 2024, with customer production targeted to begin in 2027.

 This collaboration underscores VIS and NXP’s shared commitment to innovation, sustainability, and value creation. The joint venture will engage closely with customers, suppliers, local talent, and government partners to strengthen Singapore’s role in the global semiconductor ecosystem while delivering long‑term benefits to stakeholders.

 For further information: https://www.vis.com.tw/en/press_detail?itemid=19824