27 October 2025 – VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors, proudly announces a significant milestone in its journey to becoming a global leader in semiconductor manufacturing: the First Tool Move-In at its state-of-the-art 300mm wafer fabrication facility in Singapore.

This achievement marks the transition from construction to operational readiness, paving the way for production capabilities at the advanced facility.

The new fab will manufacture specialty semiconductors on mature process nodes ranging from 130nm to 40nm, serving diverse applications across automotive, industrial, and consumer markets. Designed with automation, precision, and sustainability at its foundation, the facility integrates cutting‑edge systems to deliver reliable, high‑quality production at scale.

The milestone reflects the dedication and collaboration of teams across VIS, NXP, VSMC, and valued partners. VSMC extends its appreciation to all who contributed to realizing this vision.

Moving Forward, Stronger Together.